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Preliminary

Intel®New Gen Core™ ultra; 2x DDR5 SO-DIMM to 128GB IBECC; 20 PCIe Gen4 lanes; 4x USB 3.2 Gen2; 3x DDI, eDP/LVDS
SMARC 2.2 Compliant module (82 x 50 mm) powered by Intel®Alder Lake-N, Amston Lake (Atom® x7000RE), and Twin Lake (Core Processor N) Series SoCs, featuring onboard LPDDR5 SDRAM
Intel®Wildcat Lake; LPDDR5, UFS 3.1; dual HDMI®/eDP; 2.5GbE; USB 3.2, USB 2.0; M.2 E-Key; TPM, GPIO, I2C/SMBus, Smart FAN
PNAC-31110 builds on Intel®Denverton C3758R 1U rackmount system with up to 8x ETH ports , 1x Proprietary ETSFF OCP NIC 3.0 Slot.
1 U Rackmount System with Intel®Amston Lake x7809C(8C) Processor for SD-WAN solution
NVIDIA Jetson Orin AI module; 2x 2.5GbE RJ45 with PoE+; 1x M.2 Key-M 2242/60 (PCIe x4); OCP design based
21.5” Intel®Core™ Ultra 125U fanless stainless steel panel PC with bezel-free design, TPM 2.0, Intel®vPro® support, IP66/IP69K full-sealed anti-corrosion enclosure, optional IP67 M12 connectors, 100% waterproof, CE/FCC/VCCI Class B certified.
Intel®PTL-H; 4P+8E+4LPE; 12Xe GPU (120 TOPS), NPU 5 (50 TOPS); 2x DDR5 SO-DIMM to 128GB IBECC; 12 PCIe Gen4 lanes; USB3.2, SATA, DDI, eDP/LVDS; MIPI-CSI
Intel®Core™ Ultra (Panther Lake-H) platform with up to 180 TOPS AI performance. Supports DDR5 7200MT/s, triple display (HDMI®/USB-C), and OOB remote management.
Supports Twin/Amston Lake platform, up to 16GB DDR5, triple display via HDMI®/DP/LVDS, dual 2.5GbE, 4x USB 3.2 Gen2, M.2 E/B Key expansion, and onboard TPM 2.0 for enhanced security.
Powered by Intel®Core™ Ultra Series 200S socket processors, this platform delivers high-performance computing with advanced AI acceleration through an integrated NPU. It supports PCIe Gen5 expansion, up to 192GB DDR5 memory, and versatile high-speed I/O including USB4, multiple display outputs, and rich connectivity options—making it ideal for next-generation edge computing and AI-driven applications.