COM Express 系列

COM Express® 定義了電腦模組(Computer-on-Modules)的標準化外形尺寸與接腳配置。此標準包含三種尺寸:mini 規格(84 x 55mm)、compact 規格(95 x 95mm)以及 basic 規格(125 x 95mm)。

為了滿足產業需求,COM Express® 模組的接腳定義近期新增了數位顯示介面(DisplayPort、HDMI®)與高速的 USB 3.0。

Portwell PCOM-C60F support the COM Express type6 module Basic and Compact Sizes with ATX size(305x244mm) form factor. This carrier board passed the most of Portwell evaluation testing. These functions include but are not limited to a rich complement of high speed interfaces such as PCIe, USB4, SATA. And also support several legacy I/O such as UART, GPIO, SMBUS, I2 C.
Intel® PTL-H; 4P+8E+4LPE; 12Xe GPU (120 TOPS), NPU 5 (50 TOPS); 2x DDR5 SO-DIMM to 128GB IBECC; 12 PCIe Gen4 lanes; USB3.2, SATA, DDI, eDP/LVDS; MIPI-CSI
Micro-ATX Form Factor Evaluation Carrier Board For Type 10 COM Express@ Rev 3.0 Module
COM Express Type 7 Basic Module based on Intel® Xeon® D-1800 Processors with Two Channels and Two SO-DIMM slots.
Intel® Atom® C3000/C3000-Refresh series SoC based on Type 7 Compact COM-Express® module with up to Dual Channels and 2x DDR4 ECC SO-DIMM Socket
Intel® Atom® x7000 series SoC based on Type 10 mini COM-Express® module with LPDDR5 SDRAM
COM Express Type 6 Basic size module with Intel New Gen Core Ultra 200 Series Processor DDR5 SO-DIMM, DDI, PCIe Gen 4,USB 3.2 Gen2, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP, SATA
COM Express® Type6 Compact size module with Intel Atom® x7000E/RE Series SoC DDR5 SO-DIMM, DDI, PCIe Gen 3, USB 3.2 Gen2, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP, SATA
COM Express Type6 Compact size module with Intel® 13th Gen P/U Processor DDR5 SO-DIMM, DDI, PCIe Gen 4, USB4, USB 3.2 Gen2, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP, SATA
COM Express Type 7 Basic Module based on Intel® Xeon® D-1700 Processors with Three Channels and Four SO-DIMM slots
COM-Express® Type 7 Basic module with AMD® Embedded RyzenTM V3000 CPU Family equipped on-module NVME SSD
COM Express Type6 Basic size module with Intel® 13th Gen H Processor DDR5 SO-DIMM, DDI, PCIe Gen 4, USB 3.2 Gen2, 2.5Gb Ethernet, discrete TPM 2.0, eDP, SATA
Mini-ITX size carrier board for COM Express Type6 module  
Intel® Tiger Lake-UP3 Core™ Processor based on Type VI COM Express module with dual DDR4 SO-DIMM, DDI, eDP, Gigabit Ethernet, SATA 3.0, and USB 3.2
Intel® Xeon® D-1600 series SoC based on Type 7 Basic COM-Express® module
COM Express Type-VI Basic module with Intel® 11th Gen H Processor with DDR4 SO-DIMM, DDI, PCIe Gen 4.0, USB 3.2 Gen2x1, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP/LVDS, SATA III and VGA
Intel® Atom® x6000 series SoC based on Type 10 Mini COM-Express® module with LPDDR4 SDRAM
Intel® Atom® Elkhart Lake series SoC based on Type 6 Compact COM-Express® module with 2x DDR4 SD-DIMM Socket
PCOM-C615 is PICMG 1.3 Full Size Form Factor Evaluation Carrier Board for COM Express® Revision 2.0 Type VI Module. PCOM-C615 follows standard PICMG 1.3 golden finger pin definition and let customer save system total cost for easily upgrading modules

ATX Form Factor Evaluation Carrier Board for Type 6 Com-Express® Rev 3.0 Module

Intel® Comet Lake-S Core™ Processor based on Type VI COM Express module with dual DDR4 SO-DIMM, DDI, LVDS, VGA, Gigabit Ethernet, SATA III, and USB 3.2 Gen2
Intel® Coffee Lake-S Core™ Processor based on Type VI COM Express module with dual DDR4 SO-DIMM, DDI, LVDS, Gigabit Ethernet, SATA III, and USB 3.2 Gen2
Intel® Atom® C3000/C3000-Refresh series SoC based on Type 7 Basic COM-Express® module with 3x DDR4 ECC SO-DIMM Socket
Intel® 7th Generaon Core™ Kaby Lake-S processors based on Type VI Compact-COM Express 2.0 module with DDR4 SDRAM on Two SO-DIMM slots, VGA, eDP, DP, Gigabit Ethernet, PCIE, SATA and USB
Intel® Core™ 7th Generaon Processor based on Type VI COM Express module with DDR4 SDRAM, VGA, LVDS, Gigabit Ethernet, SATA 3.0 and USB
Intel® Kaby Lake‐U Core™ i7/i5/i3 processor based on Type VI Compact‐COM Express 2.0 module with DDR4 SDRAM on SO‐DIMM slots, VGA, LVDS, Display‐port, Gigabit Ethernet, PCIE, SATA, USB, and OTG
Intel® Pentium® / Xeon® D-1500 series Processor based on Type 6 COM Express® 2.0 module with DDR4 ECC/Non-ECC 3x SODIMM sockets, VGA, DDI, PCIex 16, USB 3.0, and SATA 6 Gb/s
Intel® Core™ Kaby Lake-U/Skylake-U i7/i5/i3 series processor based on Type 6 Compact COM-Express® module with 2x DDR4 SD-DIMM Socket
Intel® Atom® Apollo Lake series SoC based on Type 6 Compact COM-Express® module with 2x DDR3L SD-DIMM Socket
Intel® Atom® E3900 series SoC based on Type 10 Mini COM-Express® module with LPDDR4 SDRAM, eMMC and USB 3.0
Intel® AtomTM N3000 series based TypeVI COM Express with DDR3L SDRAM, VGA, LVDS, USB 3.0, PCIE and surround design.Intel® AtomTM N3000 series based TypeVI COM Express with DDR3L SDRAM, VGA, LVDS, USB 3.0, PCIE and surround design.
Data protection is more and more important in real world since big data rising. Portwell adopt new Intel platform to provide highest secure logic. It help customer earn trust and business by securing important information anytime

Intel® Atom® Bay trail series SoC based on Type 6 COMExpress® module with DDR3L 1x SD-DIMM Socket

3rd Generation Intel® Core™ processor family based Type VI Com Express with DDR3 SDRAM, VGA, LVDS, Gigabit Ethernet, 6Gbps SATA, and USB3.0
Intel® Atom® E3800 series SoC based on Type 10 Mini COM-Express® module with DDR3L SDRAM, NANDrive and USB 3.0
ATX Form Factor Evaluation Carrier Board for COM Express Revision 3.0 Type VII Module with 4x 10GbE Support with Inphi CS4227 PHY
Mini-ITX Form Factor Evaluation Carrier Board for Type 6 Com-Express® Rev 2.1 Module
PCOM-C640 is NANO-ITX carrier board with triple display, Gigabit Ethernet, Audio, USB 3.0, SATA. It’s a powerful carrier which is suitable for system.
Intel® Core™ Whiskey Lake-U i7/i5/i3 series processor based on Type 6 Compact COM-Express® module with 2x DDR4 SD-DIMM Socket